Minerva Printer: ValCUN’s EIC-Backed Breakthrough
ValCUN, a leading innovator in metal Additive Manufacturing (AM), proudly announces it has been selected to receive European Innovation Council (EIC) funding. ValCUN was selected in a highly competitive process, along with 46 other companies, out of a total of 648 full proposals submitted.
The funding will be composed of a €2.5M grant, and the option to receive up to €5M in additional equity funding and the funding will go towards advancing ValCUN’s proprietary Molten Metal Deposition (MMD) technology.
The MMD process is a single-step metal deposition, using readily available off-the-shelf metal wire as feedstock, ensuring user-friendly operation and rapid implementation resulting in a cost reduction of 75% to more than 90% compared to other metal AM technologies. This opens the door towards industrial and serial production. MMD offers unmatched sustainability, with its energy efficiency, reduced waste and elimination of the need for toxic chemicals or powders. Because of its straight-forward post-processing (no need for de-binding, sintering, powder removal or HIP), MMD also offers exceptional time-to-part.
ValCUN has recently announced it will unveil its Minerva printer and its Minerva Printhead, both based on MMD technology and specifically targeting the aluminum space, at FormNext, which is taking place this week in Frankfurt, Germany. ValCUN has further announced it had received its first order for the Minerva Printer from Sirris, Belgium’s premier research center.
Jonas Galle, CEO of ValCUN, expressed his excitement about the EIC funding: “We are thankful to the EIC for selecting ValCUN for this highly competitive and prestigious program. We are committed to enabling sustainable, safe, and cost-effective metal manufacturing solutions and are excited to have the EIC recognize the potential of the MMD technology to deliver on our vision. With this funding, we aim to push the boundaries of what’s achievable in the world of Advanced Manufacturing”.
ValCUN will be showcasing its solutions at Booth E32, Hall 12.0 at FormNext this week.